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The Agentic AI Chip Design Environment
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Meet the Visionaries
The Brains Behind the Breakthrough
Leadership
William Wang
CEO & Founder
Walden Rhines
Advisor, Former CEO of Mentor Graphics (Siemens EDA)
Raúl Camposano
Advisor, Former CTO of Synopsys
Jack Harding
Advisor, Former CEO of Cadence
Sandeep Bharathi
Advisor, President of the Data Center Group at Marvell
Erez Tsur
Advisor, Former CEO of Cadence Israel
John Bowers
Advisor & Board Member, Electrical Engineering Pioneer
Wen Hsieh
Board Member, Founding Managing Partner at Matter Venture Partners
Lance Co Ting Keh
Board Member, Venture Partner at Bessemer Venture Partners
Ivan Bercovich
Board Member, General Partner at ScOp Venture Capital
Team
Solaiman Rahim
Chief Product Officer
Mehir Arora
Head of Engineering
Harrison Balistreri
Head of Business Development and Strategic Partnerships
Cindy Cui
VP, Application Engineering & Global Customer Success
Emily Yan
Head of Marketing
Kexun Zhang
Head of Research
Explore AI-Driven Design
Jul 7, 2026
Building Multi-Agent Systems for ASIC Flows
Semiconductor Engineering discussion on building multi-agent AI systems for ASIC design flows.
Jul 7, 2026
Limitations on Transistor Scaling and the Memory Wall
A look at the physical limits of transistor scaling and the growing memory wall challenge.
May 18, 2026
Agentic AI in Chip Design
How agentic AI is transforming chip design and verification workflows.
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In the Spotlight
The latest from our blog and newsroom
Blog
ChipAgents Founder and CEO Wins Entrepreneur of the Year Award, Says "Believe in Young People"
Newsroom
ChipAgents and AWS Partner to Advance AI-Powered Semiconductor Engineering
Newsroom
Trusted Agentic AI for Semiconductor Engineering: ChipAgents Achieves SOC 2 Type II Attestation
Blog